Diamond Flux FA241
High Active Soldering Flux
Soldering Electronics PCB
Repairing Oxidized PCB pads
High Active Soldering Flux FA241 Description
Diamond Flux FA241 must be cleaned with any PCB cleaner.
The shelf life of Diamond Flux FA241 is 2 years from the date of manufacture.
High Active Diamond Flux FA241 Сharacteristics
Class ROM1. Necessary to clean
Boiling Point: 280°C
Softening Point: 70°C
Phisical State: Gel Paste
Copper Mirror Test: Pass
Current Leaking Test: Pass
Conforms to Standard J-STD-004B and ROHS
High Active flux in 10g syringe with plunger
Suitable for Soldering with Lead and Lead-Free Alloys
Good Wettability of Soldered Surfaces During PCB Repair
For Highly Oxidized PCB Surfaces and Electronic Components
Solder Flux Can be Conducting and Corrosive Depending from many factors
For Soldering PCBs, BGA, QFN, QFP, SOIC, SMD, DIP and another components
After soldering electronics, a mandatory complete cleaning is required
When working indoors, use air exhaust from the soldering area
Documents
Soldering flux FA241 User Data Sheet
Soldering flux FA241 Safety Data Sheet
About Diamond Flux FA241 from Developers
Diamond Flux FA241 is a high-activity soldering flux developed and packaged in Hallandale Beach, Florida.
Solder Flux Diamond Flux FA241 was designed for soldering and repair work where standard low-activity flux is not strong enough. It helps remove oxide films from PCB pads, copper surfaces, and other difficult-to-wet metal areas, improving solder wetting and helping form a reliable solder joint.
This soldering flux is especially useful for PCB repair, restoration of oxidized pads, and soldering surfaces that have been affected by moisture, water exposure, or long-term oxidation. If the metal surface is badly damaged by oxides, solder may not wet the pad properly without a more active flux.
Because Diamond Flux FA241 is an active flux, residues should be cleaned thoroughly after soldering. This is especially important when flux can remain under components, between leads, or in areas that are difficult to inspect. For soldering new electronic components on clean PCB surfaces, we recommend using a low-activity no-clean flux such as Diamond Flux FN231.
FA241 is not recommended for soldering stranded wires because flux residue can remain inside the wire strands and under the insulation, where it is difficult or impossible to clean. In this situation, remaining active residue may contribute to corrosion over time.
Each syringe is vacuum-packed to help protect the product during storage and shipping. The package includes a syringe and dispensing needle.
If you have questions about soldering, PCB repair, or the proper use of this flux, please contact us through website form.
Thank you!
