High Active Soldering Flux
Diamond Flux FA241
Soldering Electronics PCB
Soldering Plumbing Copper Pipes
Repairing Oxidized Surfaces
High Active Soldering Flux FA241 Description
Soldering flux Diamond Flux FA241 in 10g syringe is high active and will help to solder oxidized surfaces of printed circuit boards, for repair pads, for restore PCBs. Provides good metal adhesion - penetration of tin or tin-lead solder alloy into the PCB surface layer of copper or other coating of electronic printed circuit boards. Suitable for repairing any electronics, including phones, laptops and other household appliances. After soldering, you need to thoroughly clean the soldering flux using a PCB cleaner. Suitable for soldering copper pipes in plumbing.
FA241 must be cleaned with any PCB cleaner.
High Active Diamond Flux FA241 Сharacteristics
Color: Yellow, Amber
Boiling Point: 280°C
Softening Point: 70°C
Phisical State: Gel Paste
Copper Mirror Test: Pass
Current Leaking Test: Pass
Conforms to Standard J-STD-004B and ROHS
High Active flux in 10g syringe with plunger
For Highly Oxidized Surfaces, Components and Boards
High Activity Soldering Flux for oxidize surefaces
Solder Flux Can be Conducting and Corrosive Depending from many factors
Suitable for Soldering with Lead and Lead-Free Alloys
Good Wettability of Soldered Surfaces in Repair of PCBs
For Soldering and Repairing PCBs, BGA, QFN, QFP, SOIC, SMD, DIP and another components
After soldering electronics, a mandatory complete cleaning is required
When working indoors, use air exhaust from the soldering area
Boiling Point: 280°C
Softening Point: 70°C
Phisical State: Gel Paste
Copper Mirror Test: Pass
Current Leaking Test: Pass
Conforms to Standard J-STD-004B and ROHS
High Active flux in 10g syringe with plunger
For Highly Oxidized Surfaces, Components and Boards
High Activity Soldering Flux for oxidize surefaces
Solder Flux Can be Conducting and Corrosive Depending from many factors
Suitable for Soldering with Lead and Lead-Free Alloys
Good Wettability of Soldered Surfaces in Repair of PCBs
For Soldering and Repairing PCBs, BGA, QFN, QFP, SOIC, SMD, DIP and another components
After soldering electronics, a mandatory complete cleaning is required
When working indoors, use air exhaust from the soldering area
Documents
Soldering flux FA241 User Data Sheet
Soldering flux FA241 Safety Data Sheet
About Diamond Flux FA241 from Developers
Diamond Flux FA241 high active soldering flux was developed in the spring of 2024 after the formula of Diamond Flux FN231 soldering flux was reworked. Developing, Manufacturing and Packaging in Hallandale, Florida.
Five serious experiments and a large number of small tests were carried out.
To create an active flux for soldering electronics and copper pipes, it is necessary to develop a formula to effectively remove oxide films from metal surfaces without using toxic materials. At the same time, it is necessary to ensure the perfect wettability of metals to create a high-quality connection with a homogeneous metal structure after soldering.
The formula is designed so that soldering flux residues do not remain active after soldering and do not conduct electrical charges through themselves. Since oxides and soldering flux residues can get under the components, which are quite difficult to clean, this composition can be active and become conductive of electricity. Therefore, using active soldering flux FA241 to restore surfaces, clean them thoroughly, and using weakly active flux FN231 to solder new components is extremely important.
To achieve stable operation, it is necessary to select chemical components, calculate formulas and molar masses carefully. Each iteration of the solder flux formula must undergo a series of checks and tests. Testing also requires process and testing equipment. Only accurate results obtained from experiments will give a complete picture of the operation of the resulting formula.
Soldering Flux consists of organic substances processed and purified to varying degrees. Each chemical component plays a self-role in composition.
Soldering flux FA241 is active and effective in areas with oxides on the conductors. Effective in cases where the quality of surface wettability must be maximized despite the activity. Suitable for soldering and repairing printed circuit boards after exposure to moisture and water. Remember that the metal pad of the printed circuit board, eaten by oxides, will not be able to be properly tinned, and the connection will not be of sufficient quality.
It is not suitable for soldering stranded wires as flux residue may cause corrosion under the insulation. It is impossible to wash soldering flux from under the wire braid.
We packaged the product. The syringe, which also contains the needle, is vacuum-packed to prevent damage.
We will be happy to answer your questions. If you encounter any technological difficulties, please contact Amazon's internal mail! We have extensive experience in producing and repairing electronic printed circuit boards and in technological processes for any equipment used for this purpose.
Five serious experiments and a large number of small tests were carried out.
To create an active flux for soldering electronics and copper pipes, it is necessary to develop a formula to effectively remove oxide films from metal surfaces without using toxic materials. At the same time, it is necessary to ensure the perfect wettability of metals to create a high-quality connection with a homogeneous metal structure after soldering.
The formula is designed so that soldering flux residues do not remain active after soldering and do not conduct electrical charges through themselves. Since oxides and soldering flux residues can get under the components, which are quite difficult to clean, this composition can be active and become conductive of electricity. Therefore, using active soldering flux FA241 to restore surfaces, clean them thoroughly, and using weakly active flux FN231 to solder new components is extremely important.
To achieve stable operation, it is necessary to select chemical components, calculate formulas and molar masses carefully. Each iteration of the solder flux formula must undergo a series of checks and tests. Testing also requires process and testing equipment. Only accurate results obtained from experiments will give a complete picture of the operation of the resulting formula.
Soldering Flux consists of organic substances processed and purified to varying degrees. Each chemical component plays a self-role in composition.
Soldering flux FA241 is active and effective in areas with oxides on the conductors. Effective in cases where the quality of surface wettability must be maximized despite the activity. Suitable for soldering and repairing printed circuit boards after exposure to moisture and water. Remember that the metal pad of the printed circuit board, eaten by oxides, will not be able to be properly tinned, and the connection will not be of sufficient quality.
It is not suitable for soldering stranded wires as flux residue may cause corrosion under the insulation. It is impossible to wash soldering flux from under the wire braid.
We packaged the product. The syringe, which also contains the needle, is vacuum-packed to prevent damage.
We will be happy to answer your questions. If you encounter any technological difficulties, please contact Amazon's internal mail! We have extensive experience in producing and repairing electronic printed circuit boards and in technological processes for any equipment used for this purpose.
